EBALOY SNI黑色錫鎳合金工藝
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EBALOY SNI黑色錫鎳合金電鍍工藝主要設計目的是為鎳鍍層添上一層黑色裝飾性表面效果。
- 一. 工藝特性
- 由于鍍液穩(wěn)定,所產生色澤也穩(wěn)定;
- 加強防腐性能;
- 不需要保護層,因為錫鎳鍍層具有很好的耐磨損能力及防止表面氧化效果;
- 可用于滾鍍工藝。
- 二. 鍍液成份及操作條件
范?圍? ?最??佳
SNI錫鹽 g/L 8~15 ? ???????10
SNI鎳水 mL/L 160~240 ?? 200
SNI導電鹽 ????g/L ?150~280 ?? 200
SNC 3號添加劑 mL/L 10~20 15
鍍液溫度 ℃ 45~55 ? 50
電鍍時間 min. ?1~5 ? 2
pH值 7.0~8.5 ? 7.7
陽極? 炭板
陰極陽極面積比 1:1~1:2
鍍液攪拌? 陰極移動
鍍液過濾? 連續(xù)過濾
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- 三. 溶液配制
EBALOY SNI黑色錫鎳電鍍溶液是以配制好的液體提供的,鍍液可立即使用,不用稀釋或調校。若要添加個別原料,則必需少量添加及攪拌均勻才可開始電鍍。
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四.電鍍流程
EBALOY SNI黑色錫鎳工藝起到使鎳鍍層表面變成黑色的效果。其流程如下:
鍍鎳?回收?清水洗?水洗?EBALOY SNI錫鎳電鍍?后處理?回收?水洗?水洗?干燥
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五.設備
鍍槽? 加強PVC或鋼槽襯膠里
加熱器? 石英或鈦加熱筆
陽極? 炭板
攪拌? 陰極移動最少1~2m/min
過濾? 連續(xù)過濾
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- 六. 溶液控制
- 保持原材料及添加劑濃度
每100Ah各項材料的消耗如下:
SNI錫鹽 g ?140
SNI鎳水 mL ????600
SNI導電鹽 ????g ?125
SNC 3#添加劑 mL ????30
在實際生產情況下,大部分損耗來自帶出損耗,故未固定生產量時可按上面數字參考補充。
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ENLOY??SHADOW
Electrolytic black nickel process
ENLOY?陰影
電解黑鎳工藝
ENLOY??SHADOW is a multiple additive, black nickel process that will produce a decorative black deposit on steel, brass, and copper plated components. The deposits are absolutely uniform. ENLOY SHADOW deposits exhibit excellent corrosion resistance and adhesion. The process offers excellent leveling and throwing power over a wide current density range using cathode rod agitation. PLEASE READ ENTIRE TECHNICAL DATA SHEET BEFORE USING THIS PRODUCT.
ENLOY?SHADOW是一種多添加劑黑鎳工藝,可在鋼、黃銅和鍍銅部件上產生裝飾性黑色沉積物。沉積物是絕對均勻的。ENLOY SHADOW沉積物表現出優(yōu)異的耐腐蝕性和附著力。該工藝使用陰極棒攪拌,在寬電流密度范圍內提供出色的整平和投擲功率。使用本產品前,請閱讀完整的技術數據表。
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FEATURES AND BENEFITS
功能和優(yōu)點
- ??Excellent Leveling, Good Uniformity, And Ductility ?????? ???Ease And Economy Of Operation Over A Wide Current Density Range
- ???Excellent Corrosion Resistance ????????????????????????????????? ???Deposit Is Corrosion Resistant
- ???Absolutely Uniform Finish ???????????????????????????????????????? ???Virtually Eliminates Rejects
- 良好的平整度、良好的均勻性和延展性 ????????????????????????在寬電流密度范圍內操作方便且經濟
- 卓越的耐腐蝕性 ????????????????????????????????????????????????????????沉積物耐腐蝕
- 絕對均勻的表面處理 ??????????????????????????????????????????????????幾乎消除了不合格品
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MATERIALS REQUIRED
所需材料
For proper selection and use of system components, consult your Enthone-OMI representative.
如需正確選擇和使用系統(tǒng)組件,請咨詢您的Enthone OMI代表。
- ?Nickel Chloride (NiCl2 . 6H20), dry or liquid (Product Code Number UH01 or UL01).
- ?氯化鎳(NiCl2.6H20),干燥或液體(產品代碼UH01或UL01)。
- ENLOY SHADOW SN (Product Code Number 5382) is used for make up and replenishment.
- ?ENLOY SHADOW SN(產品代碼5382)用于補充和補充。
- ENLOY SHADOW NA (Product Code Number 5384) is used for make up and replenishment.
- ?ENLOY SHADOW NA(產品代碼5384)用于補充和補充。
- ENLOY SHADOW K (Product Code Number 5383) may be required for make up and replenishment. ?It is used to raise the pH.
- ?可能需要ENLOY SHADOW K(產品代碼5383)進行補充和補貨。它用于提高pH值。
- ?Hydrochloric Acid (HCl), AR grade, may be required to lower pH.
- ?可能需要AR級鹽酸(HCl)來降低pH值。
- Deionized or distilled water.
- 去離子水或蒸餾水。
EQUIPMENT REQUIRED
所需設備
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Consult Enthone-OMI Technical Service Representative for design and material ecommendations.
有關設計和材料建議,請咨詢Enthone OMI技術服務代表。
Tanks ??? ??PVC or polypropylene or steel tanks lined with these materials.
容器 PVC或聚丙烯或鋼儲罐內襯這些材料。
Racks ???? Plating rack coatings, usually PVC, must be approved by Enthone-OMI. ? ?Workpieces must be firmly attached to the racks. If the workpieces are very light, the racks should be correspond- ingly heavier to prevent swinging.
機架 ????????電鍍機架涂層,通常為PVC,必須經Enthone OMI批準。工件必須牢固地固定在機架上。如果工件很輕,支架應該相應地更重,以防止擺動。
Heating/Cooling Immersion heaters made of PTFE, PTFE coils or indirect heating.
加熱/冷卻 ????????????????由PTFE、PTFE線圈或間接加熱制成的浸入式加熱器。
Fittings All fittings should be protected with PVC.
配件 ????????????????????????所有配件均應采用聚氯乙烯保護。
Filtration Filtration will be required after solution make up or precipitation of white ???sludge.
過濾 ??????????????????白色污泥的溶液補充或沉淀后,需要進行過濾。
Rectifiers ?????????8 volt units; for high output 12 volt units may be necessary. Must have ?capacity to develop necessary direct current, with less than 5% ripple at amperage used. ?Rectifiers must be pro- tected against corrosion from acid fumes or placed away from solution.
整流器 ?????????8伏單元;對于高輸出,可能需要12伏單元。必須具有開發(fā)必要直流電的能力,在使用安培數時紋波小于5%。整流器必須進行防腐處理,以防受到酸性煙霧的腐蝕,或放置在遠離溶液的地方。
Anodes/Bags ???? Pure nickel anodes; no S-nickel. ?Anodes must be hung on pure nickel hooks; do not use tita- nium hooks or baskets. ?Anode bags are not necessary.
陽極/袋 ?????????????純鎳陽極;沒有S-鎳。陽極必須掛在純鎳掛鉤上;不要使用提塔牛鉤或籃子。不需要陽極袋。
Ventilation ?? ?Consult the American Conference of Industrial Hygienists book entitled, ? “Industrial Ventilation, A Manual of Recommended Practice.”
通風咨詢 ??????????請參閱美國工業(yè)衛(wèi)生學家會議題為“工業(yè)通風,推薦操作手冊”的書
OPERATING CONDITIONS
操作條件
Nominal 名義值 | Range 范圍 | |
pH | 5.0 | 4.5 to 5.5 |
Temperature 溫度 | 140 °F (60 °C) | 130 to 150 °F (55 to 65 °C) |
Specific Gravity (at 20 °C/68 °F)
比重(20°C/68°F時) |
1.06 g/cm3?(8.21 ° Baumé) | |
Agitation 攪拌 | Required 需要 | Rack agitation; do not use air
機架攪拌;不要使用空氣 |
Time ?時間 | 5 minutes ?????5分鐘 | 3 to 10 minutes ?3-10分鐘 |
Filtration 過濾 | Continuous; 2 to 3 times solution volume per hour
不斷的每小時溶液體積的2至3倍 |
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Current Density 電流密度 | 3.0 ASF (0.3 ASD) | 1.0 to 5.0 ASF (0.1 to 0.5 ASD) |
Voltage 電壓 | Variable ?變量 | 1.0 to 2.0 volts average
平均1.0至2.0伏 |
Rate Of Deposition - Time in seconds to ??????????????ASD ?????????????????ASF ??????????????????Time
沉積速率-時間(以秒為單位)
deposit 0.1 μm (8 μ inches) average ????????????????????0.3 ??????????????????????3.0 ??????????????????60
沉積物平均0.1μm(8μ英寸)
MAKE-UP PROCEDURE
補給程序
100 Liters
100 升 |
100 Gallons
100 加侖 |
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Nickel Chloride
氯化鎳 |
8 Kg | 67 lb |
ENLOY SHADOW SN | 6.5 liters | 6.5 gal |
ENLOY SHADOW K | 4.0 liters | 4.0 gal |
ENLOY SHADOW NA | 13.5 liters | 13.5 gal |
Deionized or Distilled Water
去離子水或蒸餾水 |
As required
根據需要 |
As required
根據需要 |
Do not premix components prior to adding to the processing tank. Add the components in the order given. For each 100 gallons (378 liters) of final operating solution, proceed as follows.
在添加到處理罐之前,不要預混合成分。按照給定的順序添加組件。對于每100加侖(378升)的最終操作溶液,進行如下操作。
- Heat 33 gallons (125 liters) of deionized or distilled water to 140 °F (60 °C). With continuous stirring, add the required amount of nickel chloride. ?Continue stirring until completely dissolved.
- 將33加侖(125升)去離子水或蒸餾水加熱至140°F(60°C)。在連續(xù)攪拌的情況下,加入所需量的氯化鎳。繼續(xù)攪拌直至完全溶解。
- With continuous stirring, add the required amount of ENLOY SHADOW SN. ??It is preferable to dilute the com- ponent with deionized or distilled water and distribute it uniformly over the surface of the solution.
2.在連續(xù)攪拌的情況下,加入所需量的ENLOY SHADOW SN。最好用去離子水或蒸餾水稀釋成分,并將其均勻分布在溶液表面。
- With continuous stirring, add the required amount of ENLOY SHADOW K. ??It is preferable to dilute the compo- nent with deionized or distilled water and distribute it uniformly over the surface of the solution.
3.在連續(xù)攪拌的情況下,加入所需量的ENLOY SHADOW K。最好用去離子水或蒸餾水稀釋成分,并將其均勻分布在溶液表面。
- ??Check pH to ensure it has not dropped below 4.0. ?If lower than 4.0, add ENLOY SHADOW K in small incre- ments with continuous stirring until pH reaches 4.5 to 5.0.
4.檢查pH值,確保其沒有降至4.0以下。如果低于4.0,則在連續(xù)攪拌的情況下少量添加ENLOY SHADOW K,直到pH達到4.5至5.0。
- ??With continuous stirring, add the required amount of ENLOY SHADOW NA. ?It is preferable to dilute the com-ponent with deionized or distilled water and distribute it uniformly over the surface of the solution.
5.在連續(xù)攪拌的情況下,加入所需量的ENLOY SHADOW NA-用去離子水或蒸餾水稀釋,并將其均勻分布在溶液表面。
- Fill to final volume with deionized or distilled water. ?Heat to operating temperature, if required.
6.用去離子水或蒸餾水填充至最終體積。如果需要,加熱至工作溫度。
- ??Filter for two to three hours. ?The operating solution is now ready for use.
7.過濾兩到三個小時。操作解決方案現在可以使用了。
OPERATION
操作
It is important that the instructions in this Technical Data Sheet are carefully followed. Operation outside the des- ignated ranges could result in defective deposits and plating rejects. Specific gravity, temperature and pH values ?should be controlled daily. The use of automatic dosing pumps is recommended. Small, frequent additions are recommended. In no instance should the amount of replenish addition be more than the make up quantity. When making additions, it is preferable to dilute the component with water or plating solution and distribute it uniformly ??over the surface of the solution.
務必認真遵守本技術數據表中的說明。超出指定范圍的操作可能導致有缺陷的沉積物和鍍層不合格。應每天控制比重、溫度和pH值。建議使用自動加藥泵。建議少量、頻繁添加。在任何情況下,補充添加的數量都不應超過補充數量。添加時,最好用水或電鍍溶液稀釋成分,并將其均勻分布在溶液表面。
Pre-treatment
預處理
Prior to plating,the work surface should be pre-treated in a dilute hydrochloric acid (5% HCl) dip.
電鍍前,應在稀鹽酸(5%HCl)浸液中對工作表面進行預處理。
Post Treatment
后處理
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After plating, an acidic drag out rinse is recommended to avoid precipitation of metal salts. ?The pH of the drag out rinse should be adjusted to 3.0 to 4.0 with hydrochloric acid.
電鍍后,建議進行酸性沖洗,以避免金屬鹽沉淀。應使用鹽酸將拖出沖洗液的pH值調節(jié)至3.0至4.0。
Maintenance
維護
The ENLOY SHADOW operating solution should be analyzed periodically for ENLOY SHADOW SN and ENLOY SHADOW NA and replenished as required. ?Analytical procedures for these two components are available from ?Enthone-OMI.
ENLOY SHADOW操作溶液應定期分析ENLOY SHADOW SN和ENLOY SHADOW NA,并根據需要補充。這兩種成分的分析程序可從Enthone OMI獲得。
OPERATION?(Cont’d)
操作(續(xù))
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EBALOY ?SNC ?BLACK ?PROCESS
黑?色?錫?鈷?合?金?電?鍍?工?藝
- 簡介
EBALOY SNC BLACK是一種裝飾性電鍍工藝,其鍍層具有一種獨特美麗黑色效果。一般此工藝是在光亮鎳或沙鎳鍍層上鍍成其特別效果。
- 工藝特性
- 具有美麗獨特之黑色鍍層。
- 鍍液穩(wěn)定性高,鍍層色澤亦較穩(wěn)定。
- 覆蓋能力高,可作滾鍍用。
- 鍍液容易調校,典型之合金電鍍困難不存在。
- 鍍液配制程序
EBALOY SNC BLACK 鍍液已經是可用液,不用稀釋或調校。
- 標準鍍液成份
SNC錫鹽 10 ?克/升
SNC鈷鹽 30 ?克/升
SNC導電鹽 320 克/升
SNC NO.1添加劑 100 毫升/升
SNC NO.3添加劑 20 ?毫升/升
- 操作流程
錫鈷合金電鍍一般都需要光亮鎳作底層電鍍,其流程如下:
光亮鍍鎳→回收→水洗→水洗→?EBALOY SNC BLACK →回收→水洗→后處理*→回收→水洗→水洗→干燥
*?后處理:主要功用是增加鍍層之防腐能力。
一般可以使用鉻酸浸洗?---?? 鉻酸片 :50 克/升
浸漬時間 :30 秒
溫?度 :室?溫
本公司出產之ECR-500亦可作為后處理工藝。
- 鍍液控制及補充量
每100安培小時消耗:
掛?鍍 滾?鍍
SNC 錫鹽 0.20 - 0.25 0.8 - 1.3 公斤
SNC 鈷鹽 0.35 - 0.40 0.9 - 1.5 公斤
SNC 導電鹽 1.0 - 1.5 7.5 - 15 公斤
SNC NO.1添加劑 0.4 - 0.7 3 - 6 升
SNC NO.3添加劑 0.08 - 0.11 0.3 - 0.6 升
補充時必須小量添加至完全溶解才可再加。
- 標準操作條件
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