mini型便攜Android通訊設(shè)備——與外圍硬件溝通橋梁

mini型便攜通訊設(shè)備概述：

        該設(shè)計介紹的是搭接Android設(shè)備與外圍硬件之間通訊的轉(zhuǎn)換工具，也叫"IOIO"。比如外部傳感器和伺服系統(tǒng)等硬件之間的通信。與其他的Android通信不一樣的是，可以采用該便攜設(shè)備自帶的java庫文件，就可以完成Android應(yīng)用程序代碼。不需要額外的Arduino草圖!這大大簡化了過程,您只需要關(guān)注你的Android應(yīng)用程序代碼。

        除了基本的數(shù)字輸入/輸出和模擬輸入,該搭接設(shè)備還處理PWM,I2C、SPI和UART控制。通過Android手機APP，就可以很容易升級的固件。

mini型便攜Android通訊設(shè)備實物展示：

Android通訊設(shè)備電路功能介紹：

• 46 total I/O pins * - featuring both open-drain, and internal pull up/down, some pins are 5V tolerant
• USB Bluetooth dongle, this particular dongle has been found to be the most compatible with Android devices. See verified devices with this dongle.
• On-board LiPO charger circuit. The LiPO is re-chargeable using any USB power source.
• Included 400 mAh LiPO battery (under the PCB)
• LED indicators for charging and full battery states
• On-board on/off switch
• Female header pins
• 16 analog inputs (10-bit)
• 9 PWM outputs
• 9 pulse inputs
• 4 UART channels
• 3 SPI channels
• 3 TWI (I2C-compatible) channels
• In addition to the headers, 19 of the IOIO pins are also exposed via solder pads for applications where sturdy/permanent connections are needed.
• On-board programmable LED (IOIO "status" LED)
• Maximum 800mA load output
• Solder pad for an optional alcohol sensor

說明：

      很有可能你的Android設(shè)備兼容該通訊設(shè)備，但我們不能絕對肯定每個Android設(shè)備制造商可以修改Android構(gòu)建。幾乎所有的設(shè)備將與MicroUSB電纜,但并不是所有將與藍牙連接,請檢查一下!

附件內(nèi)容截圖：

源文出處：https://www.adafruit.com/products/885